Qureos Mentor

3D Engineering Automation LLP

<div><div><b>Job Title</b></div><div>
SI/PI Simulation Engineer &mdash; Signal Integrity &amp; Power Integrity</div><div><b>
Job Summary</b></div><div>
An experienced <b>SI/PI Simulation Engineer</b> required to join our RF/PCB team. The candidate will be responsible for signal- and power-integrity analysis of PCBs, packages, and high-speed interconnects, supporting design reviews, verification, and troubleshooting to ensure robust electrical performance for high-frequency and mixed-signal products.</div><div><b>
Key Responsibilities</b></div><ul><li>
Perform Signal Integrity (SI) and Power Integrity (PI) simulations for PCB designs, multi-layer stacks, connectors, and packages.</li><li>
Model and analyze high-speed channels (DDR/PCIe/USB/SerDes), interconnects, vias, and transitions to meet timing, eye-diagram, and jitter budgets.</li><li>
Perform PI analysis: PDN impedance, decoupling network optimization, transient power distribution analysis, and capacitor placement.</li><li>
Extract and validate S-parameters, insertion/return loss, crosstalk (NEXT/ FEXT), time-domain reflectometry (TDR), and eye diagrams.</li><li>
Generate and validate stack-up definitions, impedance-controlled traces, differential pair routing, and design-for-signal-integrity guidelines.</li><li>
Work with PCB layout engineers to recommend layout fixes &mdash; via placement, return paths, stitch vias, plane splits, and decoupling placements.</li><li>
Support pre- and post-layout simulation workflows; run design-of-experiments (DOE) and parametric sweeps to optimize designs.</li><li>
Validate simulations with measurements (VNA, TDR, oscilloscope eye tests) and correlate models to test data.</li><li>
Document simulation reports, assumptions, mitigation plans, and provide actionable design guidelines.</li><li>
Collaborate with cross-functional teams (hardware, mechanical, RF, firmware) and participate in design reviews.</li><li>
Stay current with SI/PI best practices, signal/power modelling techniques, and industry standards.</li></ul><div><b>
Required Qualifications &amp; Skills</b></div><ul><li>
Bachelor&rsquo;s or Master&rsquo;s degree in Electronics, Electrical Engineering, or related field.</li><li>
1+ years of hands-on experience in SI/PI simulation for high-speed digital or RF systems.</li><li>
Strong understanding of transmission line theory, signal propagation, impedance control, crosstalk, reflections, and power distribution networks.</li><li>
Proficiency with at least two of the following tools:</li><li>
Ansys SIwave / HFSS</li><li>
Cadence Sigrity / Allegro SI</li><li>
Keysight ADS / EMPro / (time-domain/circuit)</li><li>
Mentor Graphics HyperLynx</li><li>
CST Studio Suite (Microwave Studio)</li><li>
Familiarity with measurement tools and lab validation: VNA, TDR, high-speed scope, jitter/de-emphasis testing, power integrity test setups.</li><li>
Good scripting skills (Python, MATLAB) for automating simulation workflows and post-processing.</li><li>
Strong problem-solving, communication skills, and ability to produce clear technical reports.</li></ul><div><b>
Preferred</b></div><ul><li>
Experience with Ansys HFSS for 3D EM extraction of connectors/complex transitions.</li><li>
Familiarity with packaging and chip-to-board interconnect (BGA modelling).</li><li>
Knowledge of EMC/EMI, thermal effects on SI/PI, and signal/power co-design.</li><li>
Experience with version control, PLM systems, and collaborative CAD tool workflows.</li><li>
Prior work in telecom, server, aerospace, or defence domains is a plus.</li></ul></div><div></div>

Simulation Engineer - Signal Integrity

<div><div><b>Job Title</b></div><div>
PCB Thermal Simulation Engineer &mdash; Electronics Cooling.</div><div><b>
Job Summary</b></div><div>
An experienced PCB Thermal Simulation Engineer is required to join our Electronics/RF/PCB design team. The candidate will be responsible for thermal analysis and cooling design of PCBs, electronic assemblies, and enclosures using ANSYS Icepak, supporting design validation, optimization, and reliability of high-power and high-density electronic systems.</div><div><b>
Key Responsibilities</b></div><ul><li>Perform steady-state and transient thermal simulations of PCBs, electronic components, and systems using ANSYS Icepak.</li><li>Model heat sources such as ICs, processors, power devices, VRMs, and passive components based on power dissipation profiles.</li><li>Create and validate PCB stack-up thermal models, including copper layers, vias, thermal pads, and material properties.</li><li>Analyze conduction, convection, and radiation heat-transfer mechanisms in electronic assemblies.</li><li>Evaluate and optimize cooling solutions: heat sinks, fans, airflow paths, vents, heat spreaders, and thermal interface materials (TIMs).</li><li>Perform airflow and CFD analysis inside enclosures to identify hot spots and improve thermal performance.</li><li>Conduct parametric studies and design-of-experiments (DOE) to optimize thermal design parameters.</li><li>Correlate simulation results with thermal measurements (thermocouples, IR camera, power tests).</li><li>Work closely with PCB, mechanical, and hardware teams to recommend thermal design improvements (component placement, copper balancing, airflow routing).</li><li>Document simulation assumptions, boundary conditions, results, and actionable thermal mitigation guidelines.</li><li>Support pre-layout and post-layout thermal analysis workflows.</li><li>Ensure designs meet reliability, derating, and temperature limits as per industry standards.</li></ul><div><b>
Required Qualifications &amp; Skills</b></div><ul><li>Bachelor&rsquo;s or Master&rsquo;s degree in Electronics, Electrical, Mechanical, Thermal Engineering or related field.</li><li>1+ years of hands-on experience in PCB or electronics thermal simulation.</li><li>Strong understanding of heat transfer principles (conduction, convection, radiation).</li><li>Proficiency with ANSYS Icepak (PCB thermal modeling, airflow, enclosure analysis).</li><li>Experience working with PCB power maps and component power dissipation data.</li><li>Ability to interpret thermal constraints, junction temperatures, and reliability limits.</li><li>Familiarity with material properties, TIMs, and PCB thermal vias.</li><li>Strong problem-solving skills and ability to generate clear technical reports.</li></ul><div><b>
Preferred</b></div><ul><li>Experience integrating ECAD (PCB) data into Icepak (from Allegro, Altium, ODB++).</li><li>Knowledge of electro-thermal co-simulation (thermal impact on SI/PI or power devices).</li><li>Familiarity with EMI/EMC or SI/PI effects influenced by temperature.</li><li>Experience with server, telecom, automotive, aerospace, or defence electronics.</li><li>Basic scripting (Python) for automation and post-processing is a plus.</li><li>Experience collaborating in multi-disciplinary design reviews.</li></ul></div><div></div>

Simulation Engineer - PCB Thermal

Join 3D Engineering Automation LLP and explore 2   exciting career opportunities. They're hiring for various roles with options for remote or on-site work. Apply today and become part of their innovative team.

3D Engineering Automation LLP

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Simulation Engineer - Signal Integrity

Simulation Engineer - PCB Thermal