Qureos Mentor

Eridu AI

<div><h1 class="jobSectionHeader"><b>About Eridu</b></h1><p>
Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate training and inference for large-scale AI models. Today&rsquo;s AI performance is frequently limited by system-level bottlenecks. Eridu AI delivers multiple industry-first innovations across semiconductors, software, and systems to unlock greater GPU utilization, reduce capital and power costs, and maximize data center efficiency. The company&rsquo;s solutions and value proposition have been validated by several leading hyperscalers.</p><p></p><p><br>
The company is led by a veteran team of Silicon Valley executives and engineers with decades of experience in state-of-the-art semiconductors, optics, software, and systems, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (World&rsquo;s leading micro-LED company and developer of the first augmented reality contact lens).</p><p></p><p><b><br>
Position Overview</b></p><p>
Eridu AI is seeking a highly technical Mechanical Engineer with deep expertise in multiphysics modeling, thermo-mechanical behavior, and advanced packaging architecture.<br>
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This is not a conventional mechanical design position. You will serve as the physics authority responsible for developing predictive first-principles models, conducting nonlinear multiphysics simulations, and experimentally validating complex thermo-mechanical systems across their full life cycle.<br>
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You will lead the mechanical design for advanced semiconductor and system-level packaging operating at extreme power density and structural constraints. This includes sustained compression environments, thermal expansion mismatch, contact mechanics, and long-term material behavior under load.<br>
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This role requires intellectual rigor, experimental ownership, and the ability to translate physics into robust, manufacturable hardware.</p><h1 class="jobSectionHeader"><b>
Key Responsibilities</b></h1><h2 class="jobSectionHeader"><b>
Multiphysics Modeling &amp; Mechanical Architecture</b></h2><ul><li> Develop first-principles analytical models (hand calculations and reduced-order models) to predict thermo-mechanical behavior of complex mechanical stacks.</li><li> Own nonlinear FEA simulations involving contact mechanics, plasticity, creep, stress relaxation, and thermal-mechanical coupling.</li><li> Analyze and optimize mechanical stack-ups under sustained compression and thermal cycling.</li><li> Evaluate material behavior under long-term stress, including fatigue, creep, and reliability degradation.</li><li> Define mechanical architecture trade-offs balancing structural integrity, thermal performance, and manufacturability.</li><li> Drive predictive modeling to anticipate failure modes before physical hardware validation.</li></ul><h2 class="jobSectionHeader"><b>
Experimental Design &amp; Validation</b></h2><ul><li> Design and execute thermo-mechanical experiments to validate analytical and simulation models.</li><li> Develop instrumentation strategies (strain gauges, thermocouples, displacement sensors, load cells, displacement measurement systems, etc.) for high-fidelity measurements.</li><li> Characterize material behavior under compression, thermal cycling, creep, and fatigue conditions.</li><li> Correlate experimental data with nonlinear FEA simulations and calibrate models for predictive accuracy.</li><li> Define accelerated life testing methodologies to assess long-term mechanical and thermo-mechanical reliability.</li><li> Establish validation frameworks spanning prototype through high-volume production.</li><li> Drive data-based decision making across the entire product life cycle.</li></ul><h2 class="jobSectionHeader"><b>
Advanced Packaging &amp; System Integration</b></h2><ul><li> Lead thermo-mechanical design of advanced semiconductor packaging (2.5D, 3D, SMT, substrate-level integration).</li><li> Investigate and develop novel packaging approaches and mechanical compression architectures.</li><li> Evaluate CTE mismatch, interfacial stress distributions, and structural stability in high-density electronic assemblies.</li><li> Collaborate with silicon, electrical, thermal, and system teams to ensure mechanical-electrical-thermal compatibility.</li><li> Assess interactions between mechanical loading, electrical integrity, and thermal performance in integrated systems.</li><li> Knowledge of electromechanical systems, including electrical contact integrity under mechanical loading, is highly desirable.</li></ul><h2 class="jobSectionHeader"><b>
Materials &amp; Reliability Engineering</b></h2><ul><li> Select and characterize materials based on mechanical, thermal, and long-term reliability behavior.</li><li> Model elastic and plastic deformation behavior in metals, polymers, and composite materials.</li><li> Lead DFMEA activities for high-risk mechanical and packaging assemblies.</li><li> Drive structured root cause investigations for reliability or yield issues using physics-based reasoning.</li><li> Incorporate statistical variation and tolerance modeling into predictive mechanical analysis.</li></ul><h2 class="jobSectionHeader"><b>
Cross-Functional Technical Leadership</b></h2><ul><li> Partner with internal and external teams (ODMs, OSATs, contract manufacturers) to ensure robust implementation of advanced packaging solutions.</li><li> Clearly communicate modeling assumptions, limitations, validation strategies, and risk areas.</li><li> Influence system architecture decisions through physics-driven insight.</li><li> Contribute to documentation including technical reports, design specifications, validation plans, and risk assessments.</li></ul><h1 class="jobSectionHeader"><b>
Minimum Qualifications</b></h1><ul><li> Master&rsquo;s degree in Mechanical Engineering, Materials Science, or related discipline.</li><li> 10+ years of experience in advanced packaging, semiconductor mechanical design, power electronics, or high-density electronic systems.</li><li> Strong foundation in mechanics of materials, contact mechanics, heat transfer, elastic and plastic material modeling, and thermo-mechanical coupling.</li><li> Demonstrated expertise in first-principles modeling and nonlinear FEA (ANSYS, Abaqus, COMSOL, or equivalent).</li><li> Experience designing and executing thermo-mechanical validation experiments.</li><li> Strong understanding of mechanical reliability under thermal cycling and sustained loading conditions.</li><li> Ability to connect analytical models, simulation results, and physical test data into predictive engineering decisions.</li><li> Strong written and verbal communication skills with the ability to clearly articulate complex technical concepts.</li></ul><h1 class="jobSectionHeader"><b>
Preferred Qualifications</b></h1><ul><li> Ph.D. in Mechanical Engineering, Materials Science, or related field.</li><li> 15+ years of experience in semiconductor packaging, high-performance compute systems, or power electronics.</li><li> Experience with compression-based mechanical architectures or high-pressure interface systems.</li><li> Experience with advanced thermal solutions including cold plates, manifolds, and liquid cooling.</li><li> Familiarity with statistical modeling and variation analysis tools (JMP or equivalent).</li><li> Experience collaborating with ODMs, OSATs, and contract manufacturers to define robust manufacturing processes.</li><li> Proficiency in 3D CAD tools (SolidWorks, Creo, or similar) for concept development and tolerance stack-up modeling.</li></ul><h1 class="jobSectionHeader"><b>
What We Are Looking For</b></h1><ul><li> Thinks in equations before CAD.</li><li> Builds predictive models grounded in physics.</li><li> Validates simulations with disciplined experimentation.</li><li> Understands material behavior beyond datasheets.</li><li> Anticipates failure modes before hardware fails.</li><li> Thrives in technically ambiguous, first-of-its-kind environments.</li></ul><p></p><h2 class="jobSectionHeader"><b><br>
Why Join Us?</b></h2><p>
At Eridu you&rsquo;ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI networking solutions, transforming data center capabilities.</p><p></p><p><br>
The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.</p><b><br>
The pay range for this role is:</b><br>
210,000 - 250,000 USD per year(San Francisco Bay Area)</div>

Senior Senior Mechanical Engineer -– Advanced Thermo-Mechanical

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Senior Senior Mechanical Engineer -– Advanced Thermo-Mechanical