Qureos Mentor

Headway Technologies

<div>
 
 
 TITLE: SR. PHOTOLITHOGRAPHY MANUFACTURING ENGINEER
 
 
 
 
 
 
 
 FLSA STATUS: EXEMPT
 
 
 
 
 
 
 
 REPORTS TO: SR. MANAGER, PHOTOLITHOGRAPY MANUFACTURING ENGINEERING
 
 
 
 
 
 
 
 SUMMARY:
 
 
 
 
 
 
 Under the direction of the Sr. Manager of Photolithography Manufacturing Engineering, the Sr. Photolithography Manufacturing Engineer is responsible for the monitoring, sustaining, and supporting day-to-day photolithography processes and programs on the manufacturing line, including developing and delivering strategies to improve and optimize materials characterization and process margins, developing and implementing practices or methodologies which reduce cost and improve operational efficiency; analyzing data, creating reports, and making presentations to groups; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products in the manufacturing line; and reviewing, updating, and maintaining all documentation and MPI&rsquo;s. This position is located in Milpitas, California.
 
 
 
 
 
 
 ESSENTIAL FUNCTIONS:
 
 
 
 
 
 <ul>
 <li>
 Monitors, sustains, and supports day-to-day photolithography manufacturing processes, programs, and activities which improve and optimize wafer quality and performance
 </li>
 <li>
 Ensures process reliability and consistency by providing technical support to operators, technicians, and other engineers
 </li>
 <li>
 Designs and conducts advanced experiments to verify process efficiency and robustness; analyzes results and reports findings
 </li>
 <li>
 Develops and implements practices or methodologies which lower cost, increase yield, and improve operational efficiency
 </li>
 <li>
 Conducts root cause analysis and implements corrective action if required
 </li>
 <li>
 Recommends improvements to photolithography processes with improve production yields via process/tool manufacturability optimization
 </li>
 <li>
 Responds to inquiries from other team members, managers, or departments
 </li>
 <li>
 Uses Statistical Process Control (SPC) and other complex software applications to analyze large volumes of data; develops charts or reports and presents findings before groups or teams
 </li>
 <li>
 Adheres to all safety policies and procedures as required
 </li>
 <li>
 Performs other duties of a similar nature or level*
 </li>
 </ul>
 
 
 
 
 
 MINIMUM QUALIFICATIONS:
 
 
 <ul>
 <li>
 Master&rsquo;s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; PhD preferred
 </li>
 <li>
 Three years of hands on experience working in either the magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role
 </li>
 <li>
 Strong analytical and critical thinking skills
 </li>
 <li>
 Hands&rsquo; on experience in SPC and Design of Experiments (DOE)
 </li>
 <li>
 Proficient in the use of Microsoft Office Applications
 </li>
 </ul>
 
 
 
 
 
 Knowledge, Skills, and Abilities:
 
 
 <ul>
 <li>
 Strong knowledge of photolithography principles, practices, and techniques
 </li>
 <li>
 Strong knowledge using steppers/scanners in a thin film manufacturing environment
 </li>
 <li>
 Knowledge of magnetic recording head or HDD manufacturing
 </li>
 <li>
 Knowledge and experience using JMP or Excel and the ability to create macro formulas
 </li>
 <li>
 Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
 </li>
 <li>
 Able to design advanced experiments, analyze results, and recommend corrective action
 </li>
 <li>
 Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
 </li>
 <li>
 Able to work productively and collaboratively with all levels of employees and management
 </li>
 <li>
 Able to comply with all safety policies and procedures
 </li>
 <li>
 Able to use critical thinking to resolve issues, examine trends, conduct root cause analysis, and make recommendations for process improvements
 </li>
 <li>
 Demonstrated analytical skills
 </li>
 <li>
 Demonstrated organizational and time management skills
 </li>
 <li>
 Demonstrated problem-solving and trouble shooting skills
 </li>
 <li>
 Flexible and able to prioritize
 </li>
 </ul>
 
 
 
 
 The annual base salary for this full-time position is between $127,967.00-$188,187.00+ bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
 
 
 
 
 
 
 WORKING CONDITIONS:
 
 
 
 The Sr. Photolithography Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally be required to push, pull, or lift up to 30 pounds.
 
 
 
 
 
 *Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
 
 
 
 
 
 TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
 
 
 
</div>

Sr. Photolithography Manufacturing Engineer

<div>
 
 
 TITLE: DRY ETCH PROCESS DEVELOPMENT ENGINEER
 
 
 
 
 
 
 
 FLSA STATUS: EXEMPT
 
 
 
 
 
 
 
 REPORTS TO: DIRECTOR, DRY ETCH PROCESS DEVELOPMENT
 
 
 
 
 
 
 
 SUMMARY:
 
 
 
 Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer is responsible for the developing and implementing new RIE, IBD, and ashing processes for next generation magnetic recording heads, including implementing new process control schemes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; researches, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.
 
 
 
 
 
 ESSENTIAL FUNCTIONS:
 
 <ul>
 <li>
 Develops and implements new dry etch processes (RIE,IBE, and Ashing) for next generation magnetic recording heads
 </li>
 <li>
 Implements new process control schemes or methodologies which ensure product manufacturability
 </li>
 <li>
 Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
 </li>
 <li>
 Adheres to appropriate timeline for introducing new processes into the manufacturing line
 </li>
 <li>
 Reviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action
 </li>
 <li>
 Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
 </li>
 <li>
 Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
 </li>
 <li>
 Partners with Equipment Engineering to research, select, and qualify new RIE tools
 </li>
 <li>
 Adheres to all safety policies and procedures as required
 </li>
 <li>
 Performs other duties of a similar nature or level*
 </li>
 </ul>
 
 
 
 
 
 MINIMUM QUALIFICATIONS:
 
 
 <ul>
 <li>
 Bachelor&rsquo;s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master&rsquo;s degree preferred
 </li>
 <li>
 One to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in dry etch process development
 </li>
 <li>
 Experience working in a wafer fab manufacturing environment
 </li>
 <li>
 Experience with Statistical Process Control (SPC)
 </li>
 <li>
 Proficient in the use of Microsoft Office Applications
 </li>
 </ul>
 
 
 
 
 
 
 
 
 &shy;&shy;Knowledge, Skills, and Abilities:
 
 
 <ul>
 <li>
 Knowledge of semiconductor or HDD industry principles, practices, and techniques
 </li>
 <li>
 Knowledge of wafer fabrication processing techniques, including process development and integration practices
 </li>
 <li>
 Knowledge of Reactive Ion Etching (RIE), IBE, and Ashing principles, practices, and techniques
 </li>
 <li>
 Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure
 </li>
 <li>
 Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
 </li>
 <li>
 Knowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate action
 </li>
 <li>
 Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
 </li>
 <li>
 Able to work productively and collaboratively with all levels of employees and management
 </li>
 <li>
 Able to comply with all safety policies and procedures
 </li>
 <li>
 Demonstrated organizational and time management skills
 </li>
 <li>
 Demonstrated problem-solving and trouble shooting skills
 </li>
 <li>
 Flexible and able to prioritize
 </li>
 </ul>
 
 
 
 
 The annual base salary for this full-time position is between $120,818.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
 
 
 
 
 
 
 WORKING CONDITIONS:
 
 
 
 The Dry Etch Process Development Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
 
 
 
 
 
 Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
 
 
 
 
 
 TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
 
 
 
</div>

Process Development Engineer

Join Headway Technologies and explore 2   exciting career opportunities. They're hiring for various roles with options for remote or on-site work. Apply today and become part of their innovative team.

Headway Technologies

ABOUT_COMPANY

Sr. Photolithography Manufacturing Engineer

Process Development Engineer