Process Engineer – Semiconductor Packaging (Wire Bond)

Location: Dholera, Gujarat

Employment Type: Full-Time

Industry: Semiconductor Manufacturing / Packaging

Experience: 3–8 Years

Role Overview

The Process Engineer – Wire Bond will be responsible for developing, optimizing, and sustaining wire bonding processes in a high-volume semiconductor packaging environment. The role focuses on process stability, yield improvement, equipment interaction, and adherence to quality and reliability standards.

Key Responsibilities

• Develop, qualify, and optimize Gold (Au), Aluminum (Al), and Copper (Cu) wire bonding processes
• Support wire bonding for QFP, QFN, SOP, and SOT semiconductor packages
• Monitor and control critical parameters including ball shear, bond pull, loop height, and stitch integrity
• Plan and execute DOE (Design of Experiments) for process optimization and new product introduction
• Analyze process capability using SPC tools (Cpk, Ppk) and drive corrective actions
• Work closely with equipment suppliers for tool setup, troubleshooting, and preventive maintenance
• Support New Product Qualification (NPQ) activities and customer technical audits
• Perform and support failure analysis using SEM, EDX, CSAM, and X-ray techniques
• Ensure compliance with JEDEC and AEC-Q100 / AEC-Q101 reliability requirements
• Apply structured problem-solving methodologies including 8D, FMEA, and DMAIC
  
  

Required Qualifications

• B.E./B.Tech or M.Tech in Electronics, Electrical, Mechanical, or Materials Engineering
• 3–8 years of hands-on experience in semiconductor packaging (OSAT or IDM environment preferred)
• Strong working knowledge of wire bonding equipment such as ASM, ASMPT, or Kulicke & Soffa
• Experience in high-volume manufacturing and production support environments
• Proficiency in statistical tools such as Minitab or JMP
• Familiarity with IATF 16949 and ISO 9001 quality systems
• Strong analytical and root-cause problem-solving skills
  
  

Preferred / Additional Experience

• Exposure to flip chip or advanced packaging technologies
• Experience supporting automotive or high-reliability semiconductor products