SW/CAD Engineer- Physical Design

About Siemens EDA

Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Position Overview

We are looking for a Software Engineer to join our CES-3DIC team in Cairo, Egypt. As a Software Engineer, you will contribute to the development of innovative software products and comprehensive workflow solutions for advanced 2.5D and 3D System-in-Package (SiP) designs. Your work will involve integrating Siemens’ industry-leading EDA and MCAD tools to facilitate architectural planning, physical design and verification, multi-die analysis (electrical, thermal, and mechanical stress), and manufacturing test, making a significant impact on the future of chip design.

Responsibilities:

• Perform moderately complex development activities, including the design, implementation, maintenance, testing, and documentation of software modules and subsystems for physical design, place-and-route, and 3D packaging.
• Develop scalable and customized solutions, streamline and automate workflows, and deploy robust production code using Python, Tcl/Tk, Bash, and other scripting tools and languages focused on physical implementation and packaging.
• Apply strong problem-solving skills to identify complex physical design, packaging, tool, or workflow issues and facilitate their resolution.
• Improve physical design and packaging flows and methodologies for advanced technology nodes, with a focus on performance, power, and area (PPA) optimization.
• Support the integration and enhancement of flows related to floorplanning, placement, routing, power integrity, signal integrity, and physical verification for 3D ICs and advanced packaging.
• Collaborate with CAD, 3D/2.5D packaging, and physical implementation teams to address workflow requirements and drive innovation in place-and-route and packaging solutions.
• Contribute to the development and integration of 3DBlox-, 3DStack-, and industry standards-based solutions relevant to 3D IC/3DStack architectures and advanced packaging.
• Manage design data and EDA infrastructure related to physical design and packaging, including tool installation and maintenance, server environment setup (Linux/Windows), resource monitoring, and troubleshooting.

Required Skills:

• Bachelor’s degree with 4+ years of experience, or a Master’s degree with 2+ years of experience, in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field.
• Strong scripting skills in Python, Tcl/Tk, and Shell/Bash.
• Strong understanding and hands-on experience with software data structures and software development in Windows and Linux environments.
• Prior experience with flow managers and Makefiles for building complex design structures and workflows.
• Proficiency in design data management and EDA infrastructure, including organizing large-scale design data, installing and upgrading EDA tools, and managing server environments.
• Deep understanding of ASIC physical design methodologies, from RTL synthesis through physical implementation (floorplanning, placement, routing, CTS, timing closure, and physical verification), including expertise in the netlist-to-GDS flow.
• Familiarity with version control systems (e.g., Git) and software development methodologies (e.g., Agile and Scrum).
• Ability to work both independently and collaboratively within a team with minimal supervision.
• Advanced English speaking and writing skills for effective communication within global teams.

Preferred Skills:

• Hands-on experience with industry-leading place-and-route tools (e.g., Cadence Innovus, Synopsys Fusion Compiler/ICC2, Siemens Aprisa) and physical verification tools (e.g., Siemens Calibre DRC, LVS, and PEX).
• Familiarity with package design tools (e.g., Cadence APD/SiP and Siemens Xpedition) and package/interposer planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, and Synopsys 3DIC Compiler).
• Experience with 3D IC/3DStack solutions and related physical implementation challenges.
• Familiarity with IC analysis tools such as Siemens HyperLynx, Ansys HFSS and RedHawk, Cadence Voltus, or Synopsys PrimeTime for signal and power integrity analysis in physical design.
• Knowledge of advanced process nodes (e.g., FinFET technologies) and their impact on physical design.

Why Us?

At Siemens Software, flexibility is how we work—hybrid by default, built on trust and autonomy. Together, 30,000 people across more than 200 countries build technology that shapes the real world. You'll grow through real projects, strong technical peers, and global mobility, backed by the scale and benefits of an industrial software leader. We're committed to equality and inclusion, and we hire based on merit, skills, and impact. Bring your curiosity and creativity and help us shape tomorrow!

Our Benefits & Rewards

The salary range for this position is $23,900 to $47,800 and this role is eligible to earn incentive compensation. The actual compensation offered is based on the successful candidate's job-related skills, experience, and relevant education/training. Siemens offers health and wellness benefits to employees; you can access the benefits available in your country via the link: https://jobs.sw.siemens.com/benefits/

Our Commitment to Equity and Inclusion in our Diverse Global Workforce

We value your unique identity and perspective. We are fully committed to providing equitable opportunities and building a workplace that reflects the diversity of society, while ensuring that we attract the best talent based on qualifications, skills, and experiences. We welcome you to bring your authentic self and transform the everyday with us.

Siemens Software. Transform the Everyday.

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