Advanced Packaging Engineer

Аbout GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .

Key Responsibilities:

The Advanced Packaging Engineer will lead the design, development, and integration of innovative co-packaged optics solutions, bridging the gap between Silicon Photonics (SiPh) PICs (Photonic Integrated Circuits) and high-speed electrical ASICs. This role demands hands-on expertise in 2.5D/3D heterogeneous integration, fiber-to-chip coupling, and thermal/mechanical optimization to deliver production-ready next-generation optical engines.

• Package Architecture & Design: Define 2.5D/3D integration strategies for co-packaging, including TSV (Through-Silicon Via), RDL (Redistribution Layer), and hybrid bonding for SiPh chiplet integration.
• Optical Coupling Solutions Development: Collaborate with cross functional teams on the design and assembly of fiber-to-chip coupling solutions to achieve low-loss optical interconnects.
• Process Integration: Develop and optimize packaging assembly flows (die-to-wafer/wafer-to-wafer) to ensure manufacturability (DfM) and reliability (DfR).
• Multiphysics Simulation: Perform thermal, mechanical (warpage), and opto-electronic simulations to validate designs.
• Root Cause Analysis: Perform failure analysis (FA) on high-speed electro-optical packages.

Required Qualifications :

• Education: Master's or PhD in Electrical Engineering, Materials Science, Applied Physics, or related field.
• Experience: 10+ years of experience in semiconductor packaging (2.5D/3D) with a specific focus on photonic or optoelectronic packaging.
• Software Proficiency: Familiarity with EDA tools (e.g., Cadence, Ansys for thermal / mechanical simulations), and scripting languages (Python) for test automation.
• Yield & Reliability: Experience with DOE (Design of Experiments), SPC (Statistical Process Control), FMEA (Failure Mode and Effects Analysis)

We Offer

• Base Salary
• Equity
• Annual Bonus Plan
• Medical Insurance