Position:

Engineer / Senior Engineer (Build & Integration)

Job Description:

Build & Integration Engineer.

Experience: 1–4 Years

Location: Hyderbad,India.

Job Summary

We are seeking a Build & Integration Engineer with hands-on experience working on Qualcomm chipset-based projects. The role focuses on managing builds, integrating code across multiple software layers, resolving build issues, and coordinating releases for Android, Modem, and BSP platforms.

Key Responsibilities

• Perform daily/weekly builds for Qualcomm-based platforms (Android / Modem / BSP)
• Generate engineering, debug, and release builds
• Resolve merge conflicts and build failures
• Debug compilation and dependency issues
• Support CI/CD pipelines (Jenkins or similar)
• Automate build and artifact generation
• Prepare release notes and documentation
• Coordinate build deliveries to QA and customers

Technical Skills – Mandatory

• Qualcomm chipset/platform experience
• Linux environment
• Git / Perforce
• Android build system like Make
• Shell scripting, basic Python

Good to Have

• Android BSP / HAL integration
• Understanding of CI-CD tools and Agile methodologies.
• OTA and signing process knowledge
• Integrate Qualcomm code drops (CAF / QSSI / vendor releases)
• Maintain and enhance build scripts

Soft Skills

• Good communication and documentation
• Ability to work in cross-functional teams
• Ownership of build quality and timelines
• Strong debugging and problem-solving skill

Location:

IN-TG-Hyderabad, India-Gowra Palladium (eInfochips)

Time Type:

Full time

Job Category:

Engineering Services