Engineering Manager

Location: New Albany, Indiana

Employment Type: Full-time / Permanent Role

On site role, 5 days a week

We are seeking an experienced Engineering Manager to lead a team of process engineers focused on developing and optimizing advanced Glass Core Technology (GCT) . This role offers the opportunity to work wafer-based processes and drive innovation in next-generation packaging technologies.

Responsibilities

• Lead engineering efforts for GCT technology development and implementation.
• Oversee fabrication processes including Through-Glass Via (TGV) and wafer-based technologies for electrical, optical, and fluidic interconnects.
• Develop and sustain process integration flows enabling novel device fabrication.
• Collaborate with Operations to resolve production bottlenecks and implement continuous improvement.
• Partner with Integration and Application Engineering to identify technology gaps and support new business opportunities.
• Manage technical project plans, team direction, and schedules.
• Identify resource needs and build a high-performing engineering team.

Requirements

• 10+ years in wafer engineering, fabrication, and engineering management.
• Proven leadership experience managing technical teams.
• Expertise in Glass, Silicon, Semiconductor, wafer process development , integration, and high-volume manufacturing.
• Hands-on experience with fab equipment: lithography (i-line), PVD, CVD, wet/dry etch (RIE), CMP, ECD Cu plating, electrical test, and characterization.
• Track record of developing integrated process flows for new product introduction.
• Strong communication skills and ability to work across functional groups.
• Bachelor’s or master’s degree in engineering (Materials Science, Chemical Engineering, Chemistry, Physics, or related).

Due to compliance requirements under U.S. (ITAR), this position requires the applicant to be a U.S. citizen.