FIND_THE_RIGHTJOB.
San Francisco, United States
Company Background:
Specter is creating a software-defined “control plane” for the physical world. We are starting with protecting American businesses by granting them ubiquitous perception over their physical assets.
To do so, we are creating a connected hardware-software ecosystem on top of multi-modal wireless mesh sensing technology. This allows us to drive down the cost and time of deploying sensors by 10x. Our platform will ultimately become the perception engine for a company’s physical footprint, enabling real-time perimeter visibility, autonomous operations management, and “digital twinning” of physical processes.
Our co-founders Xerxes and Philip are passionate about empowering our partners in the fast approaching world of physical AI and robotics. We are a small, fast growing team who hail from Anduril, Tesla, Uber, and the U.S. Special Forces.
Role + Responsibilities:
Specter is hiring a hardware mechanical engineering lead to design and develop robust sensor systems, optimize product manufacturing, and build out our hardware team + capabilities.
Potential Responsibilities include:
Define mechanical system requirements
Do systems level trades to assess sensor and compute system design with respect to other sub-systems (electronics, RF, thermal, etc)
Packaging of sensor sub-assemblies including camera, and other multi-modal systems
Packaging of compute and other electronics, including thermal and structural analysis and simulation
Packaging electronics and sub-systems
Developing high scale manufacturing to building, design and executing component and module level test procedures in order to meet environmental and system level design requirements
Building a test lab and infrastructure to execute test
Working with vendors for production, assembly and test of system components
Qualifications:
Have led a mechanical team on early stage products and high volume design
Experience with high scale production and manufacturing methods
Experience with sensor design, packaging and integration
Experience designing and building custom, high power compute + ruggedization for harsh environments
Design tool proficiency:
Solidworks/CATIA/NX
ANSYS multiphysics simulation
Familiarity with ECAD integration
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