Mechatronics Engineer

VeevoNix (a subsidiary of Veevo Tech) is engaged in research and manufacturing across electronic and energy segment products. ChargeX — a 10+ year LFP-based power storage battery, designed & built from scratch with custom built firmware, a touchscreen HMI, Hardware PCBs, and a cloud monitoring platform, LFP based storage chemistry and the electronics to hold it all together — is the first product built on this foundation, and it will not be the last.

You will be the single point of accountability for engineering delivery and manufacturing process quality at VeevoNix. You run the sprint calendar, hold the team to SOPs and delivery timelines, and act as the operational bridge between the engineering pillars and the manufacturing floor - because at ChargeX, a firmware bug and an assembly defect can have the same root cause, and someone needs to see both sides.

You will also bring practical 3D design and CAD literacy to support enclosure and casing design work - reviewing mechanical designs for manufacturability, coordinating with the Hardware Engineer on how the electronics fit the case, and helping evaluate or produce basic 3D models for new product variants.

Core responsibilities

Delivery management

• Own the engineering sprint and release calendar across all three pillars - firmware, cloud, and hardware
• Break down roadmap items from the CTO / Technical Product Manager into scoped tasks with clear owners and deadlines
• Run weekly standups and bi-weekly sprint reviews; maintain a live delivery tracker visible to the CTO
• Identify and escalate delivery risks - dependency delays, resourcing gaps, scope creep - before they become blockers
• Ensure every release (firmware OTA, cloud deployment, PCB revision) passes through a defined review and sign-off gate before going live
• Hold pillar contributors accountable to committed timelines without needing to personally review their code or circuit designs
• Leading the Product R&D function in collaboration with existing engineering teams to ensure the product(s) stay competitive and innovative.

SOP compliance & process discipline

• Own and enforce engineering process standards: Git workflow, code review requirement (peer-reviewed by pillar contributors, not by you), firmware versioning, PCB revision control
• Ensure every engineering deliverable has a documented spec, a review record, and a sign-off before release
• Audit process compliance regularly - flag and correct process drift before it becomes habitual
• Maintain the engineering SOP library and update it as the team and product evolve
• Coordinate directly with the Production Supervisor to align engineering release processes (firmware versions, BOM changes) with manufacturing SOPs - no mismatch between what engineering ships and what production builds

Manufacturing process linkage & optimisation

• Work with the Production Supervisor to understand the current 10-stage assembly process and identify where engineering decisions (design, firmware, test procedure) affect manufacturing efficiency or yield
• Review recurring NCRs (Non-Conformance Reports) from the floor and determine whether root cause is a design issue, firmware issue, or process issue - route accordingly
• Identify opportunities to simplify or improve product design for easier, faster, more reliable assembly (Design for Manufacturing / Design for Testability)
• Support the QC Engineer and Hardware Engineer in improving test fixtures and end-of-line test procedures for better throughput and accuracy
• Propose and track process improvement initiatives - cycle time reduction, defect rate reduction, rework reduction - with monthly measurable targets

Enclosure & mechanical design support (3D / CAD)

• Bring working proficiency in a 3D CAD tool (SolidWorks, Fusion 360, or equivalent) to support casing and enclosure design for new product variants
• Review and provide feedback on mechanical enclosure designs - fit, thermal considerations, cable routing, serviceability, and manufacturability
• Coordinate between the Hardware Engineer (PCB/electronics) and any external mechanical/industrial designer to ensure the case, PCB, and touchscreen integrate cleanly
• Where budget doesn't justify a dedicated mechanical designer, personally produce or modify basic 3D models for enclosure revisions and prototypes
• Maintain a library of enclosure design files, revisions, and fabrication/tooling notes

Team leadership & hiring

• Line-manage all IC engineers: weekly 1-on-1s, quarterly performance reviews, career development conversations
• Lead hiring for open engineering roles - write JDs, screen CVs, coordinate technical interviews with the relevant pillar lead or CTO for deep technical assessment
• Build a team culture of documentation, peer review, and cross-pillar knowledge sharing
• Recommend headcount changes (hire, contract, or outsource) per pillar based on delivery data, not gut feel

CTO interface & reporting

• Deliver a weekly engineering and manufacturing status report: what shipped, what's in progress, what's at risk, key process metrics
• Translate CTO product priorities into engineering commitments with realistic delivery dates
• Represent engineering and manufacturing coordination in cross-functional discussions with sales, customer experience, and the Technical Product Manager
• Flag any design or process decision with significant cost, timeline, or quality risk before it is locked in

Requirements

Essential

• 1–4 years of experience in engineering management, technical program management, or a senior technical delivery role
• A working mix of electrical and computer engineering fundamentals - enough to understand firmware, embedded systems, and cloud/backend concepts well enough to plan, question, and coordinate, without needing to be a specialist in any one
• Proven experience managing cross-functional technical teams and holding delivery timelines
• Practical working knowledge of a 3D CAD tool (SolidWorks, Fusion 360, AutoCAD, or equivalent) for enclosure/mechanical design review
• Experience working with or managing a manufacturing or production floor, or strong operational process discipline that transfers directly
• Strong documentation habits and comfort enforcing process compliance across a team
• Excellent communication skills in English and Urdu

Preferred

• Background in a hardware, electronics, or IoT product company - especially one with both a manufacturing floor and a software/cloud component
• Familiarity with Design for Manufacturing (DFM) and Design for Testability (DFT) principles
• Exposure to lean manufacturing or continuous improvement methodologies (5S, Kaizen, or similar)
• Degree in Electrical Engineering, Mechatronics, or Computer Engineering
• Prior experience in a startup or early-stage hardware company where process needed to be built from scratch

This is a full-time permanent contract-bound office-based Job & the starting salary would be 75K-120K as per professional experience + other allowances.

Pay & Perks:
- Basic Pay
- Free Company Maintained Accommodation (if required).
- Fuel Allowance (if applicable).
- Emergency Health Cover (Applicable after 01 year).
- Paid Annual Leaves.
- Employee Old Age Benefit Contribution (EOBI).
- A healthy & glass door open working environment.

Pay: Rs75,000.00 - Rs120,000.00 per month

Work Location: In person