Package Design Engineer

Аbout GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .

Key Responsibilities:

• Own the electrical and mechanical package design of advanced packages for high-speed optical interconnect and networking products, from concept and floorplanning through design release to manufacturing.
• Design advanced package architectures—including FCBGA/FCCSP, organic substrates, silicon interposers, and 2.5D/3D integration—supporting Co-Packaged Optics (CPO), Optical I/O, and pluggable optical modules.
• Develop high-density substrate routing and controlled-impedance interconnect for 112G, 224G, and 400G electrical interfaces, optimizing signal and power integrity across the package.
• Perform transmission line design, differential pair routing, via optimization, and return-current-path management to meet stringent high-speed performance targets.
• Define package stack-ups, design rules, and layout guidelines in partnership with signal integrity, power integrity, and thermal teams to meet electrical, thermal, and mechanical requirements.
• Address package reliability early in design, accounting for warpage, thermo-mechanical stress, underfill selection, and solder joint reliability through design and simulation trade-offs.
• Collaborate with silicon photonics, optical, and assembly teams on light coupling, fiber attach, and optical alignment considerations that impact package design.
• Drive design reviews, tolerance analyses, and design-for-manufacturability and design-for-assembly assessments with substrate vendors, OSATs, and internal manufacturing teams.
• Support package prototyping, bring-up, and qualification, resolving design issues and feeding lessons learned back into design rules and next-generation architectures.

Required Qualifications :

• MS or PhD in Electrical Engineering, Mechanical Engineering, Packaging Engineering, or related discipline (BS with extensive experience considered).
• 10+ years of experience in semiconductor package design.
• Proven experience designing advanced packages for high-speed networking, datacenter, or optical products.
• Strong knowledge of:
  • FCBGA/FCCSP technologies
  • Organic substrates
  • Silicon interposers
  • 2.5D/3D packaging
  • Flip-chip assembly
  • High-density substrate routing
• Experience designing packages supporting 112G, 224G, and preferably 400G electrical interfaces.
• Understanding of transmission line design, controlled impedance routing, differential pair design, via optimization, and return current paths.
• Familiarity with package reliability considerations including warpage, thermo-mechanical stress, underfill, and solder joint reliability.
• Experience working with substrate vendors and manufacturing teams.
• Strong communication and cross-functional leadership skills.

Preferred Qualifications

• Experience with silicon photonics packaging.
• Experience with Co-Packaged Optics (CPO), Optical I/O, or pluggable optical modules.
• Working knowledge of laser, photodiode, fiber attach, and optical alignment considerations.
• Familiarity with UCIe, PCIe, Ethernet, and CXL interfaces.
• Experience with AI accelerator or networking ASIC packaging.
• Knowledge of advanced cooling solutions for high-power packages.

We Offer

• Base Salary
• Equity
• Annual Bonus Plan
• Medical Insurance