STAFF - PCB Simulation Engineer

PCB Staff Simulation Engineer is a senior technical leader in high speed PCB simulation team in Digital Data Networks (DDN) business of TE Connectivity, responsible for developing new ideas, methods and solutions, providing technical guidance, directions and measurable inputs to dept objectives and goals supporting business strategies, and serving as an advisor for technical roadmaps of the function involving electrical and thermal simulations for ensuring high standards for performance, reliability, and manufacturability before prototyping and mass production at competitive cost. Staff Engineer is expected to be influential leaders, even without formal management authority, possessing strong technical expertise, problem-solving skills, and the ability to drive innovation and ensure product quality. They network with customers/external partners/suppliers/universities/professional associations to acquire new functions, knowledge and expertise. They perform work without appreciable direction. They drive results primarily through collaboration and influence and exercise considerable latitude in determining objectives and approaches to assignment.

• Education:
  
  • A bachelor’s degree in electrical or electronics engineering from a premier institute/university. A master’s degree in a related field is preferred. Consistent performance throughout entire academics (e.g. STD-X onwards).
  Experience:
  
  • Around 8~10 years of extensive hands-on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines.
  • Deep functional and foundational knowledge on printed circuit board layout, libraries and schematics, routing and manufacturability.
  Technical Skills:
  
  • Expertise with simulation tools for high-speed electrical and thermal analysis  Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
  • Deep understanding of high-speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
  • Strong understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS.
  • Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).