Production Planning

Job Description: Production Planning Lead

Location: Dholera, Gujarat

Department: Supply Chain – Production Planning (PP)

Role: Production Planning Lead

1. Role Overview

The Production Planning Lead at TSMPL will be responsible for end‑to‑end wafer fabrication planning, daily production scheduling, WIP control, and customer order fulfilment. This role ensures smooth fab operations by orchestrating wafer starts, monitoring bottlenecks, coordinating with module teams, and maintaining cycle time (CT) targets. The role requires deep understanding of fab operations, planning logic, WIP behavior, and customer service levels (CLIP/OTD).

2. Key Responsibilities

A. Order & Customer Commitment

• Provide commit delivery dates for every customer order (Order promising / ATP).
• Track and improve CLIP/Customer Line Item Performance for all customers.
• Manage re-commits when customer requests change (product change, hold, release, expedite, slow-down).
• Coordinate with Customer Ops for WIP visibility, priority lots, and shipment planning.

B. Daily Wafer Start & Production Scheduling

• Prepare daily wafer start plan across technology nodes and products.
• Execute wafer start for each order/production lot based on capacity and loading targets.
• Drive start stability , weekly loading adherence, and cycle time compliance.
• Align with diffusion, litho, etch, CMP, implant, and backend modules for capacity feasibility.

C. WIP Control & Lot Handling

• Manage daily fab WIP: status, aging, bank, bottlenecks, special lots.
• Handle Lot Handling Requests (LHN) —change product, hold, release, split/merge, expedite, slow-down.
• Monitor and maintain TTL WIP , remaining input quantities , WAT/WH/Bank levels.
• Control key lots , SHL lots , Customer Pull-in/Pull-out lots , and special event lots.

D. Production Plan, Projection & Assumptions

• Prepare weekly and monthly production/output projections .
• Identify and monitor key planning assumptions :
• Cycle time per route
• Module capacities
• Bottleneck health
• Tool availability
• Product mix impact
• Manage Consensus Demand vs Plan vs Execution alignment.

E. System & Process Ownership

• Drive PP modules in the Manufacturing Execution System (MES) and Planning System:
• Order management
• Reserve/Commit/Recommit logic
• WIP tracking & forecast
• Plan-group settings
• Daily plan creation & overrides
• Own PP procedures, SOPs, and internal controls.
• Support digital transformation, automation, and data integrity for planning.

F. Cross‑Functional Collaboration

• Work closely with:
• Planning & Logistics
• Module Engineering
• Manufacturing Operations
• Customer Operations
• Quality/PIE
• Supply Chain (Materials/Stores)
• Provide daily plan, recovery actions, and output risk visibility to stakeholders.

3. Required Skills & Competencies

Technical Skills

• Strong understanding of semiconductor manufacturing flow , routing, and WIP behaviour.
• Expertise in:
• Wafer start scheduling
• WIP management and dispatching
• CT modelling and bottleneck control
• Output projection logic
• Order management and ATP/CTP concepts
• Familiar with MES , ERP , MPS/MRP , and planning dashboards.
• Ability to interpret fab data, constraints, and convert into executable plan.

Analytical Skills

• Excellent quantitative and problem‑solving abilities.
• Ability to forecast output under variability.
• Data‑driven decision-making using dashboards, SQL, Excel, Python (optional).

Behavioral Competencies

• High ownership mindset and bias for action.
• Strong communication and cross-team coordination.
• Ability to thrive in fast-paced fab environment.
• Comfortable making decisions under uncertainty and changing priorities.

4. Qualifications & Experience

• Bachelor’s or Master’s degree in Engineering (Electronics, Mechanical, Industrial, Production, Semiconductor, or similar).
• 5–12 years experience in Production Planning within semiconductor fabs, display fabs, or complex high‑mix manufacturing preferred.
• Experience in Planning, WIP Control, Order Management, or Fab Operations highly desirable.

5. Key Performance Indicators (KPIs)

• CLIP / On-Time Delivery (OTD)
• Loading adherence & start stability
• Cycle Time adherence
• Bottleneck WIP health
• Output vs Plan accuracy
• Special lot management success rate
• Fab-wide WIP balance and control

6. Why Join TSMPL – Dholera

• Be part of India’s first advanced semiconductor fab.
• Shape foundational systems, processes, and planning architecture.
• Opportunity to influence next-gen semiconductor manufacturing in India.
• High-growth environment with cutting-edge technology.